High-speed electrical connectors are all around and essential in both consumer (e.g., smartphone) and industrial (e.g., robot) applications. However, conventional interconnects face issues with mechanical reliability, such as mechanical wear over time, and signal integrity. This poses a significant challenge in achieving long-term reliable connectivity, often becoming a bottleneck in high-performance computing systems. To address the constraints of conventional connectors, non-contact interconnect solutions utilizing solid-state technologies has been put forward. Non-contact wireless interconnects exhibit fundamental distinctions from other wireless standards, such as Wi-Fi or cellular (5G/6G), in terms of communication range and system architecture. For instance, Wi-Fi generally functions within meter ranges, whereas wireless interconnects operate at very short distances of a few millimeters to replace physically connected mechanical wires.  Carrier-modulated wireless transmission via antennas facilitates reliable and high-throughput communications over ultra-short distances, typically less than 5mm, between paired devices (inter- and intra-chip). 

Within this domain, I am investigating high-speed (multi-Gb/s), energy-efficient, and fully rotatable high-density mm-wave wireless interconnects that can be used at both room and cryogenic temperatures (specifically for quantum computing applications).