The field of wireless communication has witnessed significant progress, evolving from its first generation (1G) systems in the 1980s to the latest fifth generation (5G) systems. Due to the proliferation of connected devices and the growing need for higher data rates and larger bandwidth, the research focus is shifting towards  the millimeter-wave (mm-wave) spectrum (30–300 GHz) and sub-THz/ THz frequency spectrum (0.3-3 THz). The 5G technology achieves an impressive maximum data transfer rate of around 10 Gbps, and it is anticipated to surpass 1 Tbps for the future sixth generation (6G) communication system. 

Dielectric waveguides/fibers offer a significant opportunity for designing high-data rate interconnects at mm-wave and THz frequencies. This bridges the gap that currently exists between metallic and optical technology, providing robust and broadband interconnect solutions for short to mid-range communications. 

In a series of ongoing investigations, I am exploring the potential use of polymer/plastic fibers in tandem with CMOS transceivers  to enable high-speed data links (chip-to-chip communication) at both room and cryogenic temperatures. Furthermore, I am currently investigating the utilization of ceramic-based fibers and antennas for applications that involve extremely high temperatures, exceeding 1000 degrees Celsius.